AIXUN Z14 BGA Reballing Stencil Platform for iPhone 14/14 mini/14Pro/14ProMax Mobile Phones Motherboard Middle Frame Tin Planting Tools Air Leak Tester Packing: 263*223*60mm
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AIXUN Z14 BGA Reballing Stencil Platform for iPhone 14/14 mini/14Pro/14ProMax Mobile Phones Motherboard Middle Frame Tin Planting Tools Air Leak Tester Packing: 263*223*60mmDescription Aixun Z14 4 In 1 Motherboard Middle Frame Planting Tin Stand Platform For iPhone 14 14 Plus 14 Pro 14 Pro Max BGA Reablling Stencil Soldering Fixture. Features: 4 In 1: Supports iPhone 14 series, easily solves problems like uneven tin balls and bridging; solves with One Board, perfectly deals with mainboard middle frame tin planting of 14 full series. Accurate Mainboard Positioning: CNC high precision integrated processing, stable
Store: skorenge.com · Domain: skorenge.com
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