Hydra-MT-063 T3-T6 - Sn63Pb37 ultra-low voiding water-soluble leaded eutectic solder paste (REL0) Mesh Type:T6 (5-15µm) Powder composition: 96
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Hydra-MT-063 T3-T6 - Sn63Pb37 ultra-low voiding water-soluble leaded eutectic solder paste (REL0) Mesh Type:T6 (5-15µm) Powder composition: 96Hydra MT 063 T3 T6 Sn63Pb37 ultra low voiding water soluble leaded eutectic solder paste (REL0) Resin based water soluble REL0 (Cleaned) Tier I Aerospace Defense ultra low voiding Clear residue. Optimal viscosity. Excellent pin transfer. Suitable for CSP, QFN, LGA, etc World class printability, instant activity response Superior dispensing or stencil printing Sharp definition at high speeds Low solder balling and graping. Long stencil life Easy to
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